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2023

•  J. Missinne. et. al(2023), Compact packaged silicon photonic Bragg grating sensor based on a ball lens interface. https://doi.org/10.1016/j.optlastec.2022.108768
•  J. Missinne. et. al(2023), Silicon photonic temperature sensor: from photonic integrated chip to fully packaged miniature probe. https://doi.org/10.1117/1.JOM.4.1.011005
• J. Missinne. et. al(2023), A fully packaged silicon photonic Bragg grating temperature sensor with a compact back side interface based on a ball lens. https://doi.org/10.1117/12.2647381

2022

• Zervos, C. et al. (2022) ‘Miniaturized silicon photonics multi-sensor operating at high temperatures for use in composite materials industrial applications’, in Soskind, Y. and Busse, L. E. (eds) Photonic Instrumentation Engineering IX. SPIE, p. 42. doi: 10.1117/12.2606053.

• Neale, G. and Skordos, A. (2022) ‘Insertion of large diameter through-thickness metallic pins in composites’, Materials & Design, 216, p. 110559. doi: 10.1016/j.matdes.2022.110559.

2021

• Missinne, J. et al. (2021) ‘Laser-fabricated ball lens optical interface for back side coupling to a silicon photonics sensor chip’, in 2021 IEEE Photonics Conference (IPC). IEEE, pp. 1–2. doi: 10.1109/IPC48725.2021.9592972.